Technical Program Committee

• ACM ImmmerCom 2024 (co-located with ACM MobiCom 2024)
• EuroSys 2022 (Shadow PC)
• ACM SenSys 2022 (Shadow PC)
• ACM Wireless of the Students, by the Students, and for the Students (S3) Workshop 2021 (co-located with ACM MobiCom 2021)
• ACM MobiSys 2023 (Artifact Evaluation Committee)

External Reviewer

• Journal: IEEE TMC, IEEE Systems Journal, ACM IMWUT
• Conference: VRST 2024, BMVC 2024, ACM UIST 2024, IEEE VR 2024, ACM CSCW 2024, CogSci 2024, ISMAR 2023, IEEE VR 2023, HAI 2022, IEEE WCNC 2020, 2019, IEEE DySPAN 2018